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Vol. 1 No. 1 (2020): Volume 1 no. 1
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Published: 2020-10-26

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CFP: Submit to the Journal of Library Outreach and Engagement!
 
The editorial team of the Journal of Library Outreach and Engagement (JLOE) invites authors to submit articles for the spring 2021 issue. To be considered for publication in the spring issue, please submit your manuscript by February 1st. Please note that we do accept submissions on a rolling basis and articles submitted after the recommended deadline may be considered for publication in future issues.
 
Submissions should fall into one of three categories: a) Research/Scholarly Article; b) Feature Article/Notes from the Field; or c) Book Review. To submit a manuscript, please go to our website [Information For Authors | Journal of Library Outreach and Engagement] and follow the provided instructions for authors.
 
At JLOE, we define outreach as work done on behalf of libraries, information organizations, cultural memory institutions, and archives, using a wide variety of planned methods to facilitate library use, encourage lifelong learning, or develop relationships with community partners. Engagement consists of programs and activities that draw on our professional expertise to enhance societal good, through local and global collaborations with individuals, communities, and organizations.
 
Early career librarians or those new to academic publishing may elect to submit a full-length article to our newly formed Pre-Peer Review Program. The program pairs an author/authors with a member of our Editorial Advisory board, enabling scholars to receive feedback before they formally submit an article to the journal. Participation in the program does not guarantee publication. Instead, the program helps to demystify the academic publishing and review process.
 
We encourage early submissions and will communicate individually with each author about their manuscript’s progression through the peer review process. Questions about the timeline and editorial process may be directed to
jloe-editors@illinois.edu.